3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-BC Groove For iPhone 11/11 Pro/11 Pro-Max

3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-BC Groove For iPhone 11/11 Pro/11 Pro-Max

Features:
- With a CH5-BC groove for iPhone 11/11 Pro/11 Pro-Max
- Double heating cores: the first in the industry to adopt double heating core
- Intelligent protection: standby for 15 minutes; automatic power-off protection
- Laminated board structure: a new innovation in the industry, with uniform downward force in parallel
- Make your maintenance easier
- Efficient: 3 minutes to 183°C; 3 minutes to desolder; 3 minutes to fit
- Bending plate correction: A deformed main board is effectively corrected by the CH5 bonding structure
- Comprehensive functions: in addition to desoldering, lamination, and correction, it also supports CPU, hard disk IC, and baseband IC glue removal
- Integrated design of layered bonding and desoldering
- Digital display shows temperature clearly
- Safe disassembly and do no damage to your motherboards

Package Included:
- 1 x Set of Preheater Station