3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-A Groove For iPhone X/XS/XS-MAX

3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-A Groove For iPhone X/XS/XS-MAX

Description:
3-In-1 Motherboard Desoldering Preheater Platform is for iPhone X/XS/XS-MAX. It supports for A11 A12 CPU chip, A11 A12 HHD, iPhone X Baseband, iPhone XS/XS-MAX baseband and glue removal.

Features:
- Double heating cores: the first in the industry to adopt double heating core
- Intelligent protection: standby for 15 minutes; automatic power-off protection
- Laminated board structure: a new innovation in the industry, with uniform downward force in parallel
- Make your maintenance easier
- Efficient: 3 minutes to 183°C; 3 minutes to desolder; 3 minutes to fit
- Bending plate correction: A deformed main board is effectively corrected by the CH5 bonding structure
- Comprehensive functions: in addition to desoldering, lamination, and correction, it also supports CPU, hard disk IC, and baseband IC glue removal
- Integrated design of layered bonding and desoldering
- Digital display shows temperature clearly
- Safe disassembly and do no damage to your motherboards

Package Included:
- 1 x Set of Preheater Station