| Quantity | 3+ units | 10+ units | 30+ units | 50+ units | More |
|---|---|---|---|---|---|
| Price /Unit | $27.90 | $27.33 | $26.48 | $25.34 | Contact US |
A108 Main Unit + Battery Detection Module + 7-14PM True Tone Repair Modules + Face ID Repair Module
$91.17
AY A108 Main Unit + 12-15 Series True Tone Repair Module + 13P-15PM Series True Tone Repair Module
$66.07
AY A108 Phone Programmer + Face ID Repair Module for X-14 Series + Flex Cables for X 11 12 Series
$89.15
iBGA 12 Pro 10-In-1 BGA Reballing Stencil Platform Fits Mid-Level Motherboards For IP X/XS Max/11
Specifications:
- Model: iBGA 12 Pro
- Name: Positioning tin-planting platform for the mid-level motherboard
- Scope of application: For IP X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini motherboard box RF small board positioning, tin-planting repair applications
- Product size: 65 x 105 x 11mm/2.6 x 4.1 x 0.4"
- N.W.: 175g/0.4 lb
Package Included:
- 1 x BGA Reballing Kit
Note:
- Other items pictured are not included, for demonstration purposes only. Thank you for your understanding!
