iBGA 12 Pro 10-In-1 BGA Reballing Stencil Platform Fits Mid-Level Motherboards For IP X/XS Max/11

iBGA 12 Pro 10-In-1 BGA Reballing Stencil Platform Fits Mid-Level Motherboards For IP X/XS Max/11

Specifications:
- Model: iBGA 12 Pro
- Name: Positioning tin-planting platform for the mid-level motherboard
- Scope of application: For IP X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini motherboard box RF small board positioning, tin-planting repair applications
- Product size: 65 x 105 x 11mm/2.6 x 4.1 x 0.4"
- N.W.: 175g/0.4 lb

Package Included:
- 1 x BGA Reballing Kit

Note:
- Other items pictured are not included, for demonstration purposes only. Thank you for your understanding!